About the High performance titanium target for PVD
Titanium sputtering target is a kind of titanium product with a thin sputter coating film. The Purity is the key point for the performance of the titanium sputter coating, the higher the purity is, the better the corrosion resistance and electrical and optical properties of the titanium sputtered film. The titanium targets have a wide application for semiconductor devices(deposited film oxidized to TiO2 as a beam splitter or insulator), architecture glass, PV/Solar, Decoration, Optics, PVD coating applications. At energy titanium, we provide casting or forging titanium targets, made of titanium bar or plate and finally CNC machine, helping to increase functionality in a wide range of coating applications. Our targets are produced by high purity titanium with fine and uniform structure, committed in the low particle size in its entire service life.
The requirements for sputtering targets are higher than those in the traditional materials industry. Generally, the requirements include size, flatness, purity, content of various impurities, density, N/O/C/S, grain size and defect control. Higher or special requirements include: surface roughness, resistance value, uniformity of grain size, uniformity of composition and structure, content and size of foreign substances (oxides), magnetic permeability, ultra-high density and ultra-fine grains, etc. Magnetron sputtering coating is a new type of physical vapor phase coating method. It uses an electron gun system to emit and focus electrons on the material to be coated, so that the sputtered atoms follow the principle of momentum conversion and fly away from the material with high kinetic energy to deposit and form a film on the substrate. The material to be plated is called a sputtering target. Sputtering targets include metals, alloys, ceramic compounds, etc.
Application on the High performance titanium target for PVD
Sputtering targets are mainly applied in the electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memory, electronic control devices, etc. It can also be applied in the field of glass coating. It can also be applied to industries such as wear-resistant materials, high-temperature corrosion resistance, and high-end decorative products.
The principle of magnetron sputtering:
An orthogonal magnetic field and an electric field are applied between the sputtered target (cathode) and the anode. The required inert gas (usually Ar gas) is filled in a high vacuum chamber. A permanent magnet forms a magnetic field of 250 to 350 gauss on the surface of the target material, which, together with the high-voltage electric field, forms an orthogonal electromagnetic field. Under the action of an electric field, Ar gas ionizes into positive ions and electrons. A certain negative high voltage is applied to the target.
The electrons emitted from the target electrode are affected by the magnetic field, increasing the ionization probability with the working gas. A high-density plasma is formed near the cathode. Under the action of the Lorentz force, Ar ions accelerate and fly towards the target surface, bombarding the target surface at a very high speed. The atoms sputtered from the target follow the principle of momentum conversion and fly away from the target surface with higher kinetic energy towards the substrate to deposit and form a film. Magnetron sputtering is generally divided into two types: tributary sputtering and radio frequency sputtering. Among them, the principle of tributary sputtering equipment is simple, and its speed is also fast when sputtering metals. The application scope of radio frequency sputtering is even broader. Besides sputtering conductive materials, it can also sputter non-conductive materials. At the same time, it can be used for reactive sputtering to prepare compound materials such as oxides, nitrides and carbides. If the frequency of radio frequency is increased, it becomes microwave plasma sputtering. The commonly used type is electron cyclotron resonance (ECR) microwave plasma sputtering.
The high performance titanium targets are used in semiconductor, electronic information, physical vapor deposition (PVD) display, chemical vapor deposition (CVD) and optical applications.
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Manufacturing Process of high performance titanium targets
The manufacturing process of titanium targets involves various forging techniques, including but not limited as open die forging, closed die forging, free forging and isothermal forging.
The selection of these processes depends on the type of titanium alloy, the complexity of the required components, and the requirements of the final application. During the forging process, precise control of temperature and deformation rate is of vital importance to ensure the micro-structure and performance of the forgings.
The Quality Inspection of high performance titanium targets
(1) Geometric Shape and Size
The external dimensions of titanium targets are generally inspected with measuring tools such as steel rulers, calipers and templates. Complex-shaped die forgings can be precisely inspected by the scribing method.
(2) Surface Quality
If there are cracks, dents or folding defects on the surface of the targets, they can generally be detected by the naked eye. Sometimes when the cracks are very small and the depth of the folds is unknown, it can be observed again after the shovel is cleared. Flaw detection can be used for inspection when necessary.
(3) Internal Organization
Whether there are cracks, inclusions, porosity and other defects inside the targets can be checked by the naked eye or with a 10 to 30 times magnifying glass on the macroscopic structure of the forging cross-section. The commonly used method in production is acid etching inspection. That is, samples are cut from the parts of the targets that need to be inspected, and the macroscopic microstructure defects on the cross-section can be clearly displayed by etching with acid solution, such as forging flow line distribution, cracks and inclusions, etc.
(4) Metallographic Examination
The inspection method of observing the microstructure of the targets fracture surface with the aid of a metallographic microscope can check items such as carbide distribution, grain size and decarburization depth.
(5) Mechanical Properties
The main mechanical property inspection items are hardness, tensile strength and impact toughness. Sometimes, according to the design requirements of the parts, cold bending tests, fatigue tests, etc. can also be carried out.
The above quality inspection items are sometimes adopted respectively according to the design requirements and the actual production situation, sometimes each piece is inspected one by one, and sometimes each batch of forgings is spot-checked. Through quality inspection, it can be determined whether the forging is qualified. For defective targets, the causes should be analyzed and measures to prevent the defects should be proposed.
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