High Purity Titanium Sputtering Targets

 

 

High purity titanium sputtering targets are sputtering coating targets made of high-purity titanium or titanium alloys with a purity of 99.9% to 99.9999%.

They are mainly used in semiconductor manufacturing, flat panel displays, decorative coating, and vacuum equipment suction fields.

Its core performance indicators include purity, density (4.506-4.51 g/cm³), grain size (≤50μm), and impurity control, which must comply with domestic and international standards such as ASTM and ISO.

 

Titanium targets are used in integrated circuits to deposit barrier layers such as titanium-silicon compounds and titanium-nitrogen compounds, with a purity of 4N5-6N to meet the requirements of 0.18μm and more refined processes.

 

In the field of decoration, magnetron sputtering can be used to prepare various color film layers, and vacuum coating features both high adhesion and corrosion resistance.

In addition, titanium targets have been applied in scenarios such as medical implants and aerospace coatings due to their advantages of being lightweight and biocompatible.

The product specifications cover diameters ranging from 50 to 400mm and thicknesses from 3 to 28mm, and support customized requirements such as binding copper back targets..

 

 

1) Purity

However, in practical applications, the purity requirements for target materials also vary. For instance, with the rapid development of the microelectronics industry, the size of silicon wafers has evolved from 6 "and 8" to 12 ", while the width of wiring has decreased from 0.5um to 0.25um,0.18um and even 0.13um. Previously, a target material purity of 99.995% could meet the process requirements of 0.35um ics. The purity of the target material required for the preparation of 0.18um lines is 99.999% or even 99.9999%.

 

2) Impurity content

Impurities in the solid target material and oxygen and water vapor in the pores are the main sources of contamination for the deposited film. The requirements for different impurity contents of target materials for different uses also vary. For instance, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for the content of alkali metals and radioactive elements.

 

3) Density

To reduce the porosity in the solid target material and enhance the performance of the sputtered film, it is usually required that the target material have a relatively high density. The density of the target material not only affects the sputtering rate, but also influences the electrical and optical properties of the film. The higher the density of the target material, the better the performance of the film. In addition, increasing the density and strength of the target material enables it to better withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of target materials.

 

4) Grain size and grain size distribution

Usually, the target material has a polycrystalline structure, and the grain size can range from micrometers to millimeters. For the same target material, the sputtering rate of a target with fine grains is faster than that of a target with coarse grains. The thickness distribution of the films deposited by target sputtering with smaller grain size differences (uniform distribution) is more uniform.

 

 

 

A. Rolling and forging processes of titanium target materials

Hot rolling and cold rolling are used to process titanium materials into the required sizes and shapes.

Forging process enhances the mechanical strength and internal uniformity of the target material by improving the grain structure of the material.

 

B. Surface polishing and treatment

Surface polishing ensures that the target material has a good surface finish and reduces the unevenness during sputtering.

Surface treatment (such as removing oxide scale and fine grinding) can enhance the smooth release of sputtering particles, thereby improving the quality of the coating.

 

 

1. Purity testing of target materials

Spectral analysis instruments are used to detect impurity components (such as nitrogen, oxygen, iron, etc.) in titanium target materials to ensure that their purity reaches over 99.9%.

 

2. Physical parameter detection

Density test: The density of the target material is measured by the water displacement method to detect whether there are pores inside.

Surface roughness test: Evaluate the surface flatness of the target material using a laser interferometer.

Strength test: Ensure that the mechanical properties of the target material meet the sputtering requirements through tensile tests and hardness tests.

 

 

 

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